Originally Posted by bobbarker2
Can you link to the exact materials you used? The thermal pad/paste. Thanks.
I used a 15x15x0.5mm Copper shim. Thermal pads may be better as they give a cushioning effect compared to the shim. I used prolimatech PK-3 for the SoC-Shim side and CLU on the Shim-Plate side. Of course that isn't necessary you can just use any paste available.
Originally Posted by biustech
Do you have pics? And how is the sensation at the screen area just above the processor? is it warmer? or you can't feel any difference?
Couldn't take pics as i didn't have any other cam to take pics with. No difference as my phone was already getting warm anyway, well a difference is that the heat seems a bit more spread out now. I used to feel it concentrated on the top portion where the chip is but now its just a general warmth on the entire top half.