Originally Posted by PrimaryComplex
Finally done with the mod. After checking taking the phone apart i feel the best option to go is a 0.5mm thermal pad/copper shim. The added thickness should put a little more pressure on the SoC for better heat transfer.
Can report the same 9C difference on idle from 54 to 52.
Load temp max from 73 to 64.
Strangely everything feels smoother but could just be bias on my end.
Do you have pics? And how is the sensation at the screen area just above the processor? is it warmer? or you can't feel any difference?
Device: LG G3 D855 32GB Black
Storage: Samsung 32GB micro SD Pro UHS-I Class 10
ROM: Stock version 10J
Recovery: Tethered TWRP 22.214.171.124
Samsung Galaxy S3 16GB White
Omega Rom v58 Stock Kernel