[Modification] CPU, Ram and other IC Cooling for OCers

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whitewindhtc

Member
Aug 17, 2008
23
19
Warning: Attempt this modification at your own discretion. I am not responsible for any damages which may occur.

After attempting to OC my phone, I noticed hot spots when stressing my CPU at 1.4ghz. Looking at the anatomy of my phone (http://www.ifixit.com/Teardown/Samsung-Galaxy-S-I-9000-Teardown/7122/1), I noticed the structural mid-plate is a metallic alloy. This modification tries to cool the CPU and other heat generating ICs by using the phone's mid-plate and EMI shielding as a heatsink.

Test:
CPU stressed for 10 Min at 1.4ghz starting from a minimum cooled state. Application: “Stability Test”
Before Mod: 53oC (127.5oF) at 7 min 48 sec (I cut the test short as I did not want to overheat my phone)
After Mod: 43oC (109.5oF) at 10 min 10 sec

Procedure:
1. Teardown your phone as per the ifixit.com site and extract the mainboard.
2. Remove the simcard & MicroSD EMI Shield
3. Apply thermal compound to all the raised ICs. This allows the EMI shield to act as a small heatsink.
4. Reinstall EMI Shield and press down firmly to allow proper contact with the thermal compound
5. On the other side of the mainboard, liberally apply thermal compound onto the exposed ICs as per the pictures. Note: There is a relatively large gap between the surface of the ICs and the mid-plate.
6. Reinstall mainboard and press firmly against the mid-plate. If the thermal compound is making contact with the midplate then there should be some slight resistance when trying to lift the mainboard. If there is no resistance, then you will need to apply more thermal compound.
7. Install remaining components and close up your phone.

I used Arctic Silver 5 as I had some laying around. It is probably better to use a non metallic thermal compound, but I have yet to experience any problems with electric components.

My phone has been modded for about 2 weeks, running @ 1.5ghz and I have yet to experience any ill effects with operating system or with the OLED screen.

Though this mod is reversible, it may be messy cleaning up the thermal compound from your phone.

Happy Modding :)
 
Last edited:

PatcheZ

Senior Member
May 6, 2008
320
21
interesting idea...
although it sounds like your just trying to squish as much pb&j between the plate and the ic's.

I used Arctic Silver 5 as I had some laying around. It is probably better to use a non metallic thermal compound, but I have yet to experience any problems with electric components.
indeed, i've never had trouble with AS5 but would probably go with a non metallic compound for this.

PS wow, that's a LOT of AS5... must have cost you $5 just in compound just to do that :D
 

whitewindhtc

Member
Aug 17, 2008
23
19
Either way, conduction is almost always better than convection in terms of cooling a heat source. It might be a little messy, but the mod is quite effective.

The amount of thermal compound is quite a bit, but I wanted to ensure that I made contact with the 'heatsink'. There are many cheaper thermal compound alternatives than AS5, but I ran out of the generic white stuff.
 

evil_fish

Senior Member
Aug 1, 2010
95
3
Vaasa, Finland
very good idea.. thanks for sharing. do you think using thermal pad in this case would be better solution than thermal compound? or do think that thermal pad. won't work?

Sent from my Nexus S using xda premium
 

whitewindhtc

Member
Aug 17, 2008
23
19
Although thermal pads would be cleaner, they are also more difficult to use in this application due to the variation in gap spacing between the component and heatsink.

Sent from my GT-I9000 using XDA
 

R4DK0

Senior Member
Dec 6, 2011
165
65
Ljubljana
qrac.zapto.org
Wanted to fix the GPS antenna connector, ended doing this aswell, although just RAM and CPU. The amount of thermal grease is really enourmous for a proper contact. To anyone who will do this aswell, take your time, its not hard, just be patient :p
 
Last edited:

NDeaz

Senior Member
Dec 29, 2010
83
4
1.5ghz it's 1400mhz*107%liveoc? or what?
P.S. interesting to see benchmark results on 1.5ghz ;)
 

darkknigh_t

Senior Member
Jan 13, 2013
390
102
How are the temps with the termal pads? Do you notice any improvement?
Does the phone still heat up when oc and playing games?

Sent from my GT-I9000 using xda app-developers app
 
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R4DK0

Senior Member
Dec 6, 2011
165
65
Ljubljana
qrac.zapto.org
Do you guys get stability over 1.2-1.3GHz? Achieved with "oc" and/or "live oc"? After applying this mod, this thermal compound, the phone definately heats up more evenly.

Sent from my GT-I9000 using xda app-developers app
 

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  • 14
    Warning: Attempt this modification at your own discretion. I am not responsible for any damages which may occur.

    After attempting to OC my phone, I noticed hot spots when stressing my CPU at 1.4ghz. Looking at the anatomy of my phone (http://www.ifixit.com/Teardown/Samsung-Galaxy-S-I-9000-Teardown/7122/1), I noticed the structural mid-plate is a metallic alloy. This modification tries to cool the CPU and other heat generating ICs by using the phone's mid-plate and EMI shielding as a heatsink.

    Test:
    CPU stressed for 10 Min at 1.4ghz starting from a minimum cooled state. Application: “Stability Test”
    Before Mod: 53oC (127.5oF) at 7 min 48 sec (I cut the test short as I did not want to overheat my phone)
    After Mod: 43oC (109.5oF) at 10 min 10 sec

    Procedure:
    1. Teardown your phone as per the ifixit.com site and extract the mainboard.
    2. Remove the simcard & MicroSD EMI Shield
    3. Apply thermal compound to all the raised ICs. This allows the EMI shield to act as a small heatsink.
    4. Reinstall EMI Shield and press down firmly to allow proper contact with the thermal compound
    5. On the other side of the mainboard, liberally apply thermal compound onto the exposed ICs as per the pictures. Note: There is a relatively large gap between the surface of the ICs and the mid-plate.
    6. Reinstall mainboard and press firmly against the mid-plate. If the thermal compound is making contact with the midplate then there should be some slight resistance when trying to lift the mainboard. If there is no resistance, then you will need to apply more thermal compound.
    7. Install remaining components and close up your phone.

    I used Arctic Silver 5 as I had some laying around. It is probably better to use a non metallic thermal compound, but I have yet to experience any problems with electric components.

    My phone has been modded for about 2 weeks, running @ 1.5ghz and I have yet to experience any ill effects with operating system or with the OLED screen.

    Though this mod is reversible, it may be messy cleaning up the thermal compound from your phone.

    Happy Modding :)
    2
    performance ? Sorry bad English
    I can surely tell that performance is significantly better and noticable. I bumped speed @1.2G and it was rock stable, I tortured it through antutu and cpu stability test. 1.3G is semi stable cause It requires slight voltage bump which I did not play with (I still have to do this).
    Bat temp is around 44C after 20 min of torturing which is very good starting from low 20-23c.

    This is tested on KK cyanaosp v2.4.0 with build in kernel no special teaks or whatsoever. I will report back when I test more with voltage bump.
    1
    How are the temps with the termal pads? Do you notice any improvement?
    Does the phone still heat up when oc and playing games?

    Sent from my GT-I9000 using xda app-developers app
    1
    How are the temps with the termal pads? Do you notice any improvement?
    Does the phone still heat up when oc and playing games?

    Sent from my GT-I9000 using xda app-developers app

    I havent't measured it with any app, but noticed that the heat is more spreaded over the phone after some time playing a game... That's a good thing, I guess.