Its like yours most likely, the gap is slightly bigger than the right and it flexes slightly down, it actually needs pressure to flex so no its not really bad and like you said based on the temps sometimes it gets rigid, i think there a slightly uneven glue under one part causing the flex, i hope it disappears like you said
my cousin had a gap plus flex on the top of the device, i pressed it for him hard the moment we saw and it never came back but he is not over using his device like me
This is why im convinced the issue is temp related, i was playing THD games and i saw how the left side relaxed and the gap widened
as for the reports, where did u read melting that's really alarming
eitherway its unsafe for the device to keep operating at those temps, HTC should not listen to Nvidia, Nv never cares about the longevity of their chips and don't mind messing around with thermal limits
i hope the issue get more coverage so that HTC issues a down-clock update!
i think T3 will do just fine @ 1.3ghz!!
One of the reports in your other thread on the gap poll had a post from someone who said the polycarbonate had deformed under heating resulting in a bulge on the back. That is the second report of a bulge above the HTC logo. Another poster has developed a deformity in the casing near the bottom shaped like the battery.