[Q][GT-I9100] What is this chip?

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We're trying to complete the list of known components for the GT-I9100, but have a huge
problem trying to identify and find the correct chip specifications for a few of the chips.

One of them (U504) can be seen in the photograph and schematic below.

EDIT: This chip have probably been resolved to be the MAX8922L as shown in post #6.
So the next chip we would like to resolve is the U303 shown in post #9.
U303 has been resolved as shown in post #13.

We need this info in order to complete the "The all-in-one Galaxy S2 Hack Pack" in the
add-on post "The GT-I9100 Hack Pack AddOn-1". (For further details see that thread.)

As is shown in that link, it is listed by its Samsung part-number as:
"SS6000GQW / IC-POWER SUPERVISOR". But that chip is nowhere to be found on internet,
so it must be something else, or at least very similar to something else.

The other chips we need info about, are:

U101                                            Duplexer/Antenna Switch Module
U303    Samsung:1203-006847 ?   ?               "AA1 114" / "IC-POWER SUPERVISOR"
 U504    Samsung:1203-006884 ?   ?               "SS6000GQW / IC-POWER SUPERVISOR"
 F100    Samsung:2910-000125 ?   ?               "DUPLEXER-SAW"                 

Thanks in advance.

I think that some kind of voltage comparator which enables the charging, see connected to power mosfet.


But maybe I am wrong, could you post block diagram with higher res? Text on pins is mostly unreadable...

And it also has current monitor, see a voltage divider which acts surely as current meter (for battery I guess)

Originally Posted by HeliumX10

I think that some kind of voltage comparator which enables the charging, see connected to power mosfet.


But maybe I am wrong, could you post block diagram with higher res? Text on pins is mostly unreadable...

And it also has current monitor, see a voltage divider which acts surely as current meter (for battery I guess)

This part in bold! And afterwards the answers

Originally Posted by HeliumX10

... could you post block diagram with higher res? Text on pins is mostly unreadable...

Originally Posted by zylor

...And afterwards the answers.

According to the diagram above, the pinouts are as follows:

pin     name    i/o     path/connection         path-end-point
-------------------------------------------------------------------------------
1       VIN             
2       ISET    o       CHG_CUR_M
3       GND             
4       LDO             V_BUS_LDO_5V
5       IEOC            GND
6       EN|SET  i       CHG_EN  ("Q500")

7       GND             
8       CHGSB   o       CHG_ING_IN
9       PGB     o       TA_nCONNECTED           MAX8922 ?? ?GPIO charging connected?
10      BATT            V_BAT
11      GND             

This shows an 11th pin connected to GND. However, looking at the photo you can easily see that there are only 5 pins on each side, so unless there is also a grounded (not-visible) mid-pad, the schematics cannot be trusted. Which is also not anything new, for Samsung's service manuals.

Originally Posted by E:V:A

A
This shows an 11th pin connected to GND. However, looking at the photo you can easily see that there are only 5 pins on each side, so unless there is also a grounded (not-visible) mid-pad, the schematics cannot be trusted. Which is also not anything new, for Samsung's service manuals.

Yes, also there is maybe not 11th pin present, its grounded as two others.

What about notice of MAX8922 - it really could be it! Same pinout (yes other called pin names but with same functions), same package type. Will continue in its studying and comparing

^^ Ha! You're right, I had a second look at that datasheet. Dammit, I can't remember why I made that note! I might have seen it as a potential candidate on Maxim website, but didn't have time to check datasheet... However, I do remember thinking that the package doesn't (according to datasheet) have the exact same form factor. I.e. The side pins are too far from the edge. But reading the package notes, they also say that package shape may vary...

Pin descriptions fit best to the Maxim MAX8922L which has a "10 TDFN-EP" package. The "EP" part stand for Exposed Pad, and should be grounded, as it is, including the factory test input pin, #7.



In addition, we know the resistor values, and can calculate the maximum "fast_charge" current,
that depend on what is connected to the "CHG_CUR_M" line. (No Connection => Maximum)

ISET is connected to GND via 3 resistors in series:
R529 =  300 ohm,1%,1/16W,TP,1005
R531 =  300 ohm,1%,1/16W,TP,1005
R533 =  215 ohm,1%,1/16W,TP,1005
--------------------------------
     =   815 Ohm 
     =>  I(fast_charge) = 1500V/815Ohm = 1.84 A

while IEOC is connected to GND via R532:
R532 = 6.34K ohm,1%,1/16W,TP,1005.
     => I(top_off) = 150V/6340Ohm = 0.0236 A = 23.6 mA

However, I doubt any of the PCB traces can handle this kind of current to/from the micro-USB port. Please let me know, if you know more about this...

Is there a possibility there are more resistors in parallel with those at the other end of CHG_CUR_M?

Actual charge current setting is 650 mA.

Edit: never mind, that would make the current higher not lower... brain is fried...

Originally Posted by Entropy512

Is there a possibility there are more resistors in parallel with those at the other end of CHG_CUR_M?

That chip is a funny little devil, in that it can supply up to 2.3A in short periods (576 μs / 217 Hz) when in "GSM RF Test Mode". In addition, I now believe that the "M" part of "CHG_CUR_M", stand for "measurement", and is used by the PMIC to determine charging current. (I have not traced these lines, so don't take it as a fact.)

U303 [1203-006847] "Power Supervisor"

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The next chip we would like to document is the chip "U303". This is a 8-pin chip which is probably a power supervisor for the "UME300" MoviNAND memory. However, the only thing known about this chip is the following.

Type:           ? Power Supervisor 
Package:        8-pin
Label:          "AA1 114"
SamDesc:        "Samsung IC-POWER SUPERVISOR;"
SamPartNo:      1203-006847     

Description:    

Located close to the Modem (UPC300) and next to the Dual Comparator, LDO 
(U603,U610) and the SD card slot, it does look related to power, as it 
would not make any sense to place this chip here, if not. In addition it 
is surrounded by the resistors and capacitors: C300, C304, C356, C358, 
R623. It could be a power chip for the UME300 MoviNAND chip.
-------------------------------------------------------------------------------
Pin     Function        Description     Path/Connection
-------------------------------------------------------------------------------
1                                       ?? Seem connected to "TP_eMMC_EN" test point
2                                       
3                                       
4                                       
5                                       
6                                       C358    1000nF,10%,10V,X5R,TP,1005
7                                       C356    1000nF,10%,10V,X5R,TP,1005
8                                       C300    100nF,10%,6.3V,X5R,0603
-------------------------------------------------------------------------------

Here is the picture:

Originally Posted by E:V:A

ISET is connected to GND via 3 resistors in series:
R529 =  300 ohm,1%,1/16W,TP,1005
R531 =  300 ohm,1%,1/16W,TP,1005
R533 =  215 ohm,1%,1/16W,TP,1005
--------------------------------
     =   815 Ohm 
     =>  I(fast_charge) = 1500V/815Ohm = 1.84 A

while IEOC is connected to GND via R532:
R532 = 6.34K ohm,1%,1/16W,TP,1005.
     => I(top_off) = 150V/6340Ohm = 0.0236 A = 23.6 mA

However, I doubt any of the PCB traces can handle this kind of current to/from the micro-USB port. Please let me know, if you know more about this...

Youre right - as I expect standarts for most phones is 1,5 Amps (discharge) or 1.0 A (fast charge) max (myself measurment in other phones and battery internal circuit shuts down when 2.0 amps so 1,67 Amps is a little overdimensed for measurements because of standarts +-15% tolerances in resistors.

Could you post (or link) the full schematics of this phone ? Maybe it was posted before, but dont have so much time to spend with searching (hate me ).
I could participate even with next searched chip, but want to look at the full wirings first.