I've only had my Relay a week and already it's been torn apart! But what's bad for warranties is good for you, because now I can make a hardware reference guide for this phone like I did for the Sidekick 4G.
As before, this is a work in progress and based on my own research. I'm not an expert on cell phone tech, so everything here is provided with no warranties. Please let me know if you notice any mistakes and I'll be happy to update this document. I'm particularly interested in better documentation for the various components, like in-house PDFs.
Samsung Galaxy S Relay 4G Specifications:
Released as T-Mobile exclusive on September 19th, 2012.
SGH-T699
FCC ID: A3LSGHT699
2G Network: GSM/GPRS/EDGE – 850, 900, 1800, 1900 MHz
3G Network: UMTS/HSPA+ – 850, 900, 1700, 1900, 2100 MHz
WiFi: 802.11A/B/G/N dual-band 2.4/5GHz
Bluetooth 4.0
Near Field Communication
CPU: 32-bit 1.5GHz dual-core Qualcomm Snapdragon S4 (ARM V7 Architecture)
GPU: Qualcomm Adreno 225
RAM: 1 Gigabyte DDR2
Flash: 8 Gigabytes, ~5GB available to user under stock ROM
MicroSD slot for expansion
Display: 4" Samsung SuperAMOLED screen @ 800x480 with Multi-Touch Capacitive Touchscreen. 16,777,216 colours
Keyboard: 5 row 52-key QWERTY keyboard with inverted-T arrow keys
Rear Camera: 5 Megapixel with LED flash
Front Camera: 1.3 Megapixel
Other Features:
Augmented GPS/GLONASS
Accelerometer/Gyroscope
Compass
Light sensor/Proximity sensor
Mobile High-Definition Link (HDMI)
Size: 4.96" x 2.56" x 0.53"
Weight: 5.6 Ounces
Power: 1800mAH Lithium-Polymer rechargeable battery model EB-L1K6ILA with NFC antenna integrated.
http://downloadcenter.samsung.com/c...y_S_Relay_4G_English_User_Manual_UVLG8_F4.pdf - User manual
http://www.jax184.com/projects/Relay 4G/Draft Users Manual.pdf - Early draft of user manual, submitted during FCC approval.
Hardware Details:
0. Qualcomm MSM8260A Integrated Snapdragon S4 CPU, Adreno graphics core, UMTS modem, WiFi/Bluetooth backend, GPS/GLONASS receiver, DSP and USB controller
Marked:
Unknown
(Located under RAM IC as package-on-package)
1. Qualcomm WCD9310 "Tabla" Audio codec
Marked:
WCD9310
NCM218R1
A228002
13
2. Silicon Image SiI9244 MHL Transmitter
Marked:
SIMG
9244BO
NCS371A
10L2230
3. Samsung 8Gb (1GB) Low Power DDR2 DRAM
Marked:
Samsung 210
K3PE7E700D-XGC2
GKB2709U
4. Samsung 8GB NAND Flash
Marked:
Samsung 228
KLM8G2FE3B-B001
HHGX259X
5. Qualcomm HSPA+/CDMA2K/TDSCDMA/EDGE/GPS Transciever
Marked:
WTR1605
OVV
PHX403R1
AA22501
6. Qualcomm Dual-band Wi-Fi A/B/G/N, Bluetooth and FM Radios
Marked:
WCN3660
PGW541R1
A222002
7. Unknown
Marked:
SWt
GAD92
8. Anadigics Multimode Multiband Power Amplifier Module
Marked:
ALT6181
33945AC
1231PH
9. Anadigics AWT6624 UMTS1700 Power Amplifier
Marked:
6624R
4233AD
1230 PH
10. Anadigics AWT6622 UMTS1900 Power Amplifier
Marked:
6622R
4110AA
1228 PH
11. Invensense 6050 six-axis gyroscope/accelerometer
Marked:
Invensense
MPU-6050M
D2G554-K1
EI 1226 D
12. Qualcomm Power Management IC
PM8921
AD35130
f3228004
13. Analog Devices Mobile I/O Expander and QWERTY Keypad Controller
Marked:
ADP
5587
#215
14. Texas Instruments BQ24157 Lithium-Ion Battery Charger
Marked:
TI27A3JXI
BQ24157B
15. NXP PN544 Near Field Communication Controller
Marked:
44501
10 05
NXD2314
16. Atmel MaXTouch mXT224E
Marked:
MXT224E
MAH-IR0
2W1315B
http://www.jax184.com/projects/Relay 4G/Internal Photos.pdf - Photos of a prototype Relay submitted to the FCC for approval. Notice that the PCB, RF plate, keyboard frame and even the back cover have all been revised.
http://www.jax184.com/projects/Relay 4G/Test Results.pdf - Results of FCC testing of the NFC radio.
Take Apart:
Start with the phone turned off.
Flip the phone onto its back and remove the battery, SIM card and MicroSD card.
Remove the 8 long screws around the edge of the phone and the two short screws in the battery bay using a fine-tipped Phillips screwdriver. Be sure not to mix these screws up when reassembling!
If available, use a thin nylon guitar pick for this next step. Metal tools will mar the plastic.
Unlike most Galaxy S devices, the seam between the inner back and the front case of the Relay 4G is not visible from the back of the device. Instead it is on the front, around the perimeter of the keyboard. Insert a thin prying tool here and gently unsnap the plastic halves.
Lift the back off.
Gently disconnect the headphone jack cable. This connector is very fragile, and should not be pried on with metal tools. Instead it should be gripped with fingernails and slowly pulled upward.
Disconnect the screen cable along the left side of the board. Like the headphone jack, this connector is fragile and must not by forced apart. Then remove the 5 short screws which hold the PCB to the front frame.
Gently lift the PCB upwards. There are clips around the edge which will need to be gently pressed to free the board.
If needed, the keyboard can now be removed. To separate the keyboard frame from the screen, remove the final screw and gently pull the plastic straight up. Be sure not to put undue stress on the screen cable. It is held to the keyboard frame in the gold plate, which is attached using double-sided tape.
I did not dismantle the screen section of my phone beyond this point, but further disassembly appears to be straight forward.
To continue dismantling the PCB, gently disconnect the camera and MicroSD card socket cables. As above, these connectors are delicate and must not be forced apart.
Remove the two screws on the keypad side of the PCB to unfasten the RF plate.
Lift the RF plate off of the PCB.
The PCB is now bare.
Assemble in reverse order.
The PDFs linked to in the above document are owned by their respective companies. All else is covered by the following:
This work is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 3.0 Unported License.
As before, this is a work in progress and based on my own research. I'm not an expert on cell phone tech, so everything here is provided with no warranties. Please let me know if you notice any mistakes and I'll be happy to update this document. I'm particularly interested in better documentation for the various components, like in-house PDFs.
Samsung Galaxy S Relay 4G Specifications:
Released as T-Mobile exclusive on September 19th, 2012.
SGH-T699
FCC ID: A3LSGHT699
2G Network: GSM/GPRS/EDGE – 850, 900, 1800, 1900 MHz
3G Network: UMTS/HSPA+ – 850, 900, 1700, 1900, 2100 MHz
WiFi: 802.11A/B/G/N dual-band 2.4/5GHz
Bluetooth 4.0
Near Field Communication
CPU: 32-bit 1.5GHz dual-core Qualcomm Snapdragon S4 (ARM V7 Architecture)
GPU: Qualcomm Adreno 225
RAM: 1 Gigabyte DDR2
Flash: 8 Gigabytes, ~5GB available to user under stock ROM
MicroSD slot for expansion
Display: 4" Samsung SuperAMOLED screen @ 800x480 with Multi-Touch Capacitive Touchscreen. 16,777,216 colours
Keyboard: 5 row 52-key QWERTY keyboard with inverted-T arrow keys
Rear Camera: 5 Megapixel with LED flash
Front Camera: 1.3 Megapixel
Other Features:
Augmented GPS/GLONASS
Accelerometer/Gyroscope
Compass
Light sensor/Proximity sensor
Mobile High-Definition Link (HDMI)
Size: 4.96" x 2.56" x 0.53"
Weight: 5.6 Ounces
Power: 1800mAH Lithium-Polymer rechargeable battery model EB-L1K6ILA with NFC antenna integrated.
http://downloadcenter.samsung.com/c...y_S_Relay_4G_English_User_Manual_UVLG8_F4.pdf - User manual
http://www.jax184.com/projects/Relay 4G/Draft Users Manual.pdf - Early draft of user manual, submitted during FCC approval.
Hardware Details:
0. Qualcomm MSM8260A Integrated Snapdragon S4 CPU, Adreno graphics core, UMTS modem, WiFi/Bluetooth backend, GPS/GLONASS receiver, DSP and USB controller
Marked:
Unknown
(Located under RAM IC as package-on-package)
1. Qualcomm WCD9310 "Tabla" Audio codec
Marked:
WCD9310
NCM218R1
A228002
13
2. Silicon Image SiI9244 MHL Transmitter
Marked:
SIMG
9244BO
NCS371A
10L2230
3. Samsung 8Gb (1GB) Low Power DDR2 DRAM
Marked:
Samsung 210
K3PE7E700D-XGC2
GKB2709U
4. Samsung 8GB NAND Flash
Marked:
Samsung 228
KLM8G2FE3B-B001
HHGX259X
5. Qualcomm HSPA+/CDMA2K/TDSCDMA/EDGE/GPS Transciever
Marked:
WTR1605
OVV
PHX403R1
AA22501
6. Qualcomm Dual-band Wi-Fi A/B/G/N, Bluetooth and FM Radios
Marked:
WCN3660
PGW541R1
A222002
7. Unknown
Marked:
SWt
GAD92
8. Anadigics Multimode Multiband Power Amplifier Module
Marked:
ALT6181
33945AC
1231PH
9. Anadigics AWT6624 UMTS1700 Power Amplifier
Marked:
6624R
4233AD
1230 PH
10. Anadigics AWT6622 UMTS1900 Power Amplifier
Marked:
6622R
4110AA
1228 PH
11. Invensense 6050 six-axis gyroscope/accelerometer
Marked:
Invensense
MPU-6050M
D2G554-K1
EI 1226 D
12. Qualcomm Power Management IC
PM8921
AD35130
f3228004
13. Analog Devices Mobile I/O Expander and QWERTY Keypad Controller
Marked:
ADP
5587
#215
14. Texas Instruments BQ24157 Lithium-Ion Battery Charger
Marked:
TI27A3JXI
BQ24157B
15. NXP PN544 Near Field Communication Controller
Marked:
44501
10 05
NXD2314
16. Atmel MaXTouch mXT224E
Marked:
MXT224E
MAH-IR0
2W1315B
http://www.jax184.com/projects/Relay 4G/Internal Photos.pdf - Photos of a prototype Relay submitted to the FCC for approval. Notice that the PCB, RF plate, keyboard frame and even the back cover have all been revised.
http://www.jax184.com/projects/Relay 4G/Test Results.pdf - Results of FCC testing of the NFC radio.
Take Apart:
Start with the phone turned off.
Flip the phone onto its back and remove the battery, SIM card and MicroSD card.
Remove the 8 long screws around the edge of the phone and the two short screws in the battery bay using a fine-tipped Phillips screwdriver. Be sure not to mix these screws up when reassembling!
If available, use a thin nylon guitar pick for this next step. Metal tools will mar the plastic.
Unlike most Galaxy S devices, the seam between the inner back and the front case of the Relay 4G is not visible from the back of the device. Instead it is on the front, around the perimeter of the keyboard. Insert a thin prying tool here and gently unsnap the plastic halves.
Lift the back off.
Gently disconnect the headphone jack cable. This connector is very fragile, and should not be pried on with metal tools. Instead it should be gripped with fingernails and slowly pulled upward.
Disconnect the screen cable along the left side of the board. Like the headphone jack, this connector is fragile and must not by forced apart. Then remove the 5 short screws which hold the PCB to the front frame.
Gently lift the PCB upwards. There are clips around the edge which will need to be gently pressed to free the board.
If needed, the keyboard can now be removed. To separate the keyboard frame from the screen, remove the final screw and gently pull the plastic straight up. Be sure not to put undue stress on the screen cable. It is held to the keyboard frame in the gold plate, which is attached using double-sided tape.
I did not dismantle the screen section of my phone beyond this point, but further disassembly appears to be straight forward.
To continue dismantling the PCB, gently disconnect the camera and MicroSD card socket cables. As above, these connectors are delicate and must not be forced apart.
Remove the two screws on the keypad side of the PCB to unfasten the RF plate.
Lift the RF plate off of the PCB.
The PCB is now bare.
Assemble in reverse order.
The PDFs linked to in the above document are owned by their respective companies. All else is covered by the following:
This work is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 3.0 Unported License.