Ah ha! Finally success! Only took about 30 times opening and closing get my tablet. But I now have a very well cooled k1 chip. The thermal paste arrived, removed the thermal pad and walla, great results.
This is the k1 chip with a copper shim. I used thermal paste and some glue to glue down the shim since I don't want it moving at all.
Next, I was finally able to cut some copper and keep it flat. Fortunately it fit perfect the very first time.
As you see, I placed the 2mm thermal pad on the back side of the k1 chip. This adds pressure to the heatsink and will use the back cover as a pressure plate to always provide a good contact with the chip.
As you can see, there's a slight indentation in the thermal pad. This is from the back of the cover where it's pressing on the pad and adding pressure to the heatsink, this ensures proper contact with the chip since there's nothing to screw down the heatsink with.
Overall I have about a 10c drop in temperatures for about 35 seconds. After that it will slowly raise in temperature as the copper heat plate becomes saturated with heat. However, I used to see 85c in some benchmarks at the stock tablet, now I don't see anything past 76c.