Question Experience after reballing

[Hydro gen]

A month ago i got a used x3pro from marketplace with box
When testing before paying the phone behaved fine even on benchmark
Later the phone was randomly rebooting for no reason
I looked the thing up since it was running stock and I stumbled upon the reballing and the motherboards problem

Now the phone is completely off wont turn on
I Tried replugging the battery but no luck
So I looked for a local store that does re-balling

Am asking what are ur experiences with reballing ? Does the reball fix it or is it temporary only?

 

[Adiks009]

My front cam is not working sometimes, and sometimes sim signal is not working


Gonna reball my devices next week.

 

[rarimuru_08]

A month ago i got a used x3pro from marketplace with box
When testing before paying the phone behaved fine even on benchmark
Later the phone was randomly rebooting for no reason
I looked the thing up since it was running stock and I stumbled upon the reballing and the motherboards problem

Now the phone is completely off wont turn on
I Tried replugging the battery but no luck
So I looked for a local store that does re-balling

Am asking what are ur experiences with reballing ? Does the reball fix it or is it temporary only?

same experience... i do have a warranty from the shop but i don't think it would workfor gaming anymore :v

 

[nak3dsnail]

A month ago i got a used x3pro from marketplace with box
When testing before paying the phone behaved fine even on benchmark
Later the phone was randomly rebooting for no reason
I looked the thing up since it was running stock and I stumbled upon the reballing and the motherboards problem

Now the phone is completely off wont turn on
I Tried replugging the battery but no luck
So I looked for a local store that does re-balling

Am asking what are ur experiences with reballing ? Does the reball fix it or is it temporary only?

mine still in testing as post-reball is less than week old but I doesn't encounter any problem so far and it is same like before the deadboot happened and I learned my lesson that I'm not playing much games now and overheat my cpu past 80°c because it's the main issue of x3pro getting deadboot the cpu solder deforming making shorted.

my advice to you is dont choose random technician but only people that has experienced a lots of successful repair of Px3Pro , in my case I seached in FB and checked every technician post of what they accomplished and watch post of video of them doing the reball.

 

[rarimuru_08]

mine still in testing as post-reball is less than week old but I doesn't encounter any problem so far and it is same like before the deadboot happened and I learned my lesson that I'm not playing much games now and overheat my cpu past 80°c because it's the main issue of x3pro getting deadboot the cpu solder deforming making shorted.

my advice to you is dont choose random technician but only people that has experienced a lots of successful repair of Px3Pro , in my case I seached in FB and checked every technician post of what they accomplished and watch post of video of them doing the reball.

:0 idk if it's normal that after doing the fix my phone is hot for about a week
mine shutdown when i tried to play 4 games straight i'm sitting in front of a cooler while i'm playing... i don't feel any heat at all that's why i'm confident it woudn't happened again ; - ; but then **** happened it shutdown mid game ; - ; it does have a warranty from the technician but idk if i could still sell it for a good price... i know i already ****ed up when i risk reballing it... i was so excited i forgot to do a lil research...

 

[nak3dsnail]

:0 idk if it's normal that after doing the fix my phone is hot for about a week
mine shutdown when i tried to play 4 games straight i'm sitting in front of a cooler while i'm playing... i don't feel any heat at all that's why i'm confident it woudn't happened again ; - ; but then **** happened it shutdown mid game ; - ; it does have a warranty from the technician but idk if i could still sell it for a good price... i know i already ****ed up when i risk reballing it... i was so excited i forgot to do a lil research...

forgot to tell you that im using NGK app now with overlay of tracking the cpu temp in top left, i can still play games with px3pro but not hardcore like before. Anyway the deadboot happened to me was when im playing 2hours straight while charging, no cpu temp and screen stucked for couple mins then died, cant turn on, nor charging response like no sign of life and told myself the my cpu solder melted or deformed and need a reball.

 

[atti9935]

After reballing Bukeh, ultra wide and micro Cameras are not working, main camera and front camera are working fine, rest of device is great. Sometime sensors stop working which is a know issue for Poco X3 pro, for that we have to restart the device.

 

[Tsuragi]

what if, you apply glue to prevent the cpu from moving? like old computers. technically if it is thermal glue it should not melt with the heat generated, just a idea

 

[Ulthrone]

what if, you apply glue to prevent the cpu from moving? like old computers. technically if it is thermal glue it should not melt with the heat generated, just a idea
View attachment 5929107

Interesting

 

[tomas5123]

what if, you apply glue to prevent the cpu from moving? like old computers. technically if it is thermal glue it should not melt with the heat generated, just a idea
View attachment 5929107

Looking at reballing videos for the Poco X3 Pro, the SOC has the glue already around it from preventing it from moving.

I'm also not really sure if 80°C can even melt the solder. Most solders even leaded onces start to get softer at like 180°C which is way more. Maybe the board is just flexing too much from heating up and cooling down and that causes cracks in the solder. Also I'm not really sure if they are even legally allowed to use leaded solder which has the lower melting temperature, I think that stuff was outlawed for most consumer devices and only really legal for home users.

:0 idk if it's normal that after doing the fix my phone is hot for about a week
mine shutdown when i tried to play 4 games straight i'm sitting in front of a cooler while i'm playing... i don't feel any heat at all that's why i'm confident it woudn't happened again ; - ; but then **** happened it shutdown mid game ; - ; it does have a warranty from the technician but idk if i could still sell it for a good price... i know i already ****ed up when i risk reballing it... i was so excited i forgot to do a lil research...

Seeing in the same video, they remove the glue/bonding stuff between the top chip (RAM) and the bottom chip (SOC) so could be that after reballing the heat will be transferred a lot worse than before.

Because in all of those videos I don't see them adding any of that glue or bonding material back, not sure how much it contributes to heat transfer, but it's probably way better than an air pocket.

 

[Tsuragi]

I don't know much about soldering but i know that flux is not glue, although there is a thermal glue that at some point was used in the first notebooks, i wouldn't know why it is not currently used, perhaps it may be because the solder expands whens hot and having the chip attached can crack the soc over time.

Looking on the internet the closest thing to this type of glue would be epoxy resin, i don't know why it is not used but it would be interesting if someone tried it.

I currently bought a poco x3 pro dead for pmic at 13 usd, i sent it to a technical service, if they repair it i will try

 

[tomas5123]

I don't know much about soldering but i know that flux is not glue, although there is a thermal glue that at some point was used in the first notebooks, i wouldn't know why it is not currently used, perhaps it may be because the solder expands whens hot and having the chip attached can crack the soc over time.

Looking on the internet the closest thing to this type of glue would be epoxy resin, i don't know why it is not used but it would be interesting if someone tried it.

I currently bought a poco x3 pro dead for pmic at 13 usd, i sent it to a technical service, if they repair it i will try

What do you mean? The video does show that the chips is sorrounded by some black epoxy like glue and not flux.
They just use flux and the soldering iron to chisel the remainders out of the board so that when putting the chip back on it lays flat on there.

Here at like 4:52 the glue residues are removed.

I don't see them put that stuff on afterwards or even during the videos. Also there is some black glue type thing between the RAM and the CPU that get's completly removed. They don't replace that with anything.

At like 9:18 the glue between the soc and the ram is removed. The stuff on the middle.

So in theory after the reballing is done the whole thing should probably dissipate heat a bit worse than before, and the whole thing now relies on just the solder to keep it fixed in position.

I don't think resoldering would degrade anything with the PMIC, because it's not a stacked chip.


Tbh I'm curious if just heating up a broken Poco X3 pro, without fully reballing it would help let it boot up again, this wouldn't be an ideal solution or permanent at all but better than to worry about your data.

Edit:
Found a PDF detailing what exactly that stuff is. It's called an underfill for package on packge chips.
And it provides:
"Mechanical Bond providing compensation for Thermal Mismatch, Mechanical Shock, Proprietary Protection"
And is required due:
– Thinner PCB
– Lead free solder
– Impact Shock CSP to Board Displacement in the Z-Axis"

They also have a few more images that show the benefit of it.

https://www.ipc.org/system/files/technical_resource/E7%26S34_02.pdf

So I would be cautious after getting a reballing, because I'm not sure if they also apply that stuff afterwards and the whole chip only relies on the solder balls to stay in place and withstand bending from heating up. :/

 

[desihu]

What do you mean? The video does show that the chips is sorrounded by some black epoxy like glue and not flux.
They just use flux and the soldering iron to chisel the remainders out of the board so that when putting the chip back on it lays flat on there.

Here at like 4:52 the glue residues are removed.
View attachment 5976801

I don't see them put that stuff on afterwards or even during the videos. Also there is some black glue type thing between the RAM and the CPU that get's completly removed. They don't replace that with anything.

At like 9:18 the glue between the soc and the ram is removed. The stuff on the middle.

View attachment 5976803

So in theory after the reballing is done the whole thing should probably dissipate heat a bit worse than before, and the whole thing now relies on just the solder to keep it fixed in position.

I don't think resoldering would degrade anything with the PMIC, because it's not a stacked chip.


Tbh I'm curious if just heating up a broken Poco X3 pro, without fully reballing it would help let it boot up again, this wouldn't be an ideal solution or permanent at all but better than to worry about your data.

Edit:
Found a PDF detailing what exactly that stuff is. It's called an underfill for package on packge chips.
And it provides:
"Mechanical Bond providing compensation for Thermal Mismatch, Mechanical Shock, Proprietary Protection"
And is required due:
– Thinner PCB
– Lead free solder
– Impact Shock CSP to Board Displacement in the Z-Axis"

They also have a few more images that show the benefit of it.

https://www.ipc.org/system/files/technical_resource/E7%26S34_02.pdf

So I would be cautious after getting a reballing, because I'm not sure if they also apply that stuff afterwards and the whole chip only relies on the solder balls to stay in place and withstand bending from heating up. :/

Thanks for the details, i had my doubts on reball from the start and your post futher satisfy the logic. Also by experience I can say the it is only a temporary solution, plus the heat dissipation is actually bad after that. Mine worked only 3 days after reball, and thenafter almost 6 months of lying dead again wokeup but for 15 days only, before going dead again.

 

[tomas5123]

Thanks for the details, i had my doubts on reball from the start and your post futher satisfy the logic. Also by experience I can say the it is only a temporary solution, plus the heat dissipation is actually bad after that. Mine worked only 3 days after reball, and thenafter almost 6 months of lying dead again wokeup but for 15 days only, before going dead again.

yeah it really depends on the quality of reballing to be honest. If they did a bad job from the getgo it always will be bad, and it sounds like the bga balls don't make perfect contact in your case so that they disconnect when the board flexes from slight heat changes (turning on or off).

If they did a good job then the only issue should be maybe heat dissipation and durability during falling, though even that can be limited.

Also I did found some bga underfill und aliexpress so maybe you can just fully fix it with that. It's called "

WYLIE WL-108 BGA IC Chip Glue CPU Underfill Adhesive For iPhone Nand Touch IC Hard Disk Repair Filler Glue Repair Tool "​

so you could just apply it yourself. The stuff gets automatically sucked under the two chips after soldering is done. (atleast if you look at the videos on how that stuff is applied)

 

[Tsuragi]

Speaking of reballing, they finally delivered my poco x3 pro, which was supposed to be the pmic and then it was cpu reballing. the result? now it doesn't even turn on any lights and the battery is punctured, according to the technical service "the ram is missing contacts" what kind of response is that XD, well i didn't lose money..... at least I have a spare screen, don't trust him technical service even if the store seems of good quality.

 

[tomas5123]

Speaking of reballing, they finally delivered my poco x3 pro, which was supposed to be the pmic and then it was cpu reballing. the result? now it doesn't even turn on any lights and the battery is punctured, according to the technical service "the ram is missing contacts" what kind of response is that XD, well i didn't lose money..... at least I have a spare screen, don't trust him technical service even if the store seems of good quality.

Wtf,

don't they normally inform you before doing anything other than what is requested? Also yeah it feels like reballing is really dependend on who does the repair.

If it is someone skilled than it should work without any issues (maybe more heat) :/

I wish I had super cheap defective X3 Pro, otherwise I would try my hand on reballing it.

 

[suvambit]

Today I Will Share My Worst Experienced with my OnePlus 7 pro.

I bought OnePlus 7 pro in 2019. After 3 year use in 2022 it dead. I did reballing from nearest repair shop.

After 1 Year my mobile again dead, then I go nearest shop, they open my mobile's back, and get the motherboard, then where Ram and CPU locate there they used some fluid type thing then using heater heat that particular location, then fluid spread automatically between ram & CPU. Then they connect motherboard with the phone and also attach battery, then again it start from dead end.

After some months I got some crashes like stuck screen and auto reboot, then sometimes crashes then auto reboot, after some days it again dead. Not working while charging or press any button.

Again I go to the shop they again do some heat and some fluid in motherboard between ram & CPU, then again it start to work.

Is that problem not solve till now, may be after some months it will happen again with my op7pro. So give me suggestions if any permanent solution there. I want to buy motherboard any place where I can buy in Cheap price, because OnePlus care sell motherboard in high price.