Edit: DISCLAIMER: Just because this worked for me does not mean it will work for you. It is STUPID easy to blow off micro components, warp motherboards, or otherwise completely destroy electronics using a hot air station if you do not have experience with using them. Do not try this unless you are 100% comfortable turning your phones motherboard into a 100% irreparable piece of scrap.
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Has anyone tried reflowing the Micron chip? I've successfully repaired other devices (not phones) that failed due to cracked solder balls by reflowing them.
Edit : SUCCESS!! (as least as far as I was willing to take it)
I opened the phone, made up a little foil mask to protect the tiny components from getting blown off, set my hot air station to 350C, and removed the metal cover hiding the Micron chip (the CPU and some other chips are in there too)
I added liberal amounts of flux around the Micron chip and added heat until the solder balls remelted and it passed the nudge test. Yes I know this risks shorting out solder balls but I don't have a full BGA rework station and the phone was dead anyway so I couldn't break it more
Anyway got it to nudge and pull back in place, I let the board cool, reassembled it, plugged it in, and it booted right up. Couldn't believe it. No signs of anything every happening to the phone, worked just fine. I quickly copied off all my data
So if you have the tools/experience to try the reflow give it a shot, maybe it will work for you too. I would not trust the device to stay operational long term, if the BGA connections failed on one chip, they are likely failing on other chips, and oxidation can form in solder ball cracks and prevent a solid electrical connection even after a reflow so it wouldn't surprise me if the device randomly died again. I just wanted the data off I already moved on to another device, never buying a Pixel again. Screw multi billion dollar corporations using the cheapest parts and assemblers they can find to save a penny at the expense of users.