Since we have no dedicated hardware modding subforum I just went for the mod section - feel free to move the thread accordingly if I am in the wrong.
Recently I broke my OP3 and bought two used ones with shattered displays of ebay, assembling a frankenstein sort of phone with my working parts. Now I have two working OP3s, my daily driver and one with a shattered display. In addition, I have one that is almost completely ruined and useless. That got me thinking.
I recently saw a lot of manufacturers incorporating heat pipes made of copper, filled with a little liquid into their devices to spread the heat from the SoC more efficiently along the backside of the device. Namely the Razer Phone, The Galaxy S8 and S9, the new Pocophone F1, just to name a few. Naturally, these parts come available at replacement shops for cheap. Like here for example: https://stellatech.com/en/samsung-sm-g950f-galaxy-s8-heat-pipe,a,828202.html/
Now, since my OP3 tends to get hot in the SoC/Camera area not only during gaming, I thought why not try fitting one of these to the aluminum back of the phone. The OP3 appears to have some sort of thermally conducting sticker, connecting the SoC under its shield to the aluminum back for heat dissipation.
My plan would be to Dremel a groove into the aluminum back, to fit the heat pipe. Then secure it in place with thermally conducting glue, alternatively thermal paste and some drops of epoxy along the way. Remove the shield from the soc, cut the sides off for easier alignment and solder it to the heat pipe.
Then add some thermal paste to the CPU and GPU and press the back/heat pipe/shield assembly on, closing up the phone. Paste would have to be replaced every time the phone is opened though.
I am open to any suggestions how to better achieve this as well as educated guesses on the effectiveness of my project.
I
Recently I broke my OP3 and bought two used ones with shattered displays of ebay, assembling a frankenstein sort of phone with my working parts. Now I have two working OP3s, my daily driver and one with a shattered display. In addition, I have one that is almost completely ruined and useless. That got me thinking.
I recently saw a lot of manufacturers incorporating heat pipes made of copper, filled with a little liquid into their devices to spread the heat from the SoC more efficiently along the backside of the device. Namely the Razer Phone, The Galaxy S8 and S9, the new Pocophone F1, just to name a few. Naturally, these parts come available at replacement shops for cheap. Like here for example: https://stellatech.com/en/samsung-sm-g950f-galaxy-s8-heat-pipe,a,828202.html/
Now, since my OP3 tends to get hot in the SoC/Camera area not only during gaming, I thought why not try fitting one of these to the aluminum back of the phone. The OP3 appears to have some sort of thermally conducting sticker, connecting the SoC under its shield to the aluminum back for heat dissipation.
My plan would be to Dremel a groove into the aluminum back, to fit the heat pipe. Then secure it in place with thermally conducting glue, alternatively thermal paste and some drops of epoxy along the way. Remove the shield from the soc, cut the sides off for easier alignment and solder it to the heat pipe.
Then add some thermal paste to the CPU and GPU and press the back/heat pipe/shield assembly on, closing up the phone. Paste would have to be replaced every time the phone is opened though.
I am open to any suggestions how to better achieve this as well as educated guesses on the effectiveness of my project.
I
