replace it with copper plate that best option i measure the thickness is 2.5 mm or 2mm better take 2.5 mm and use sandpaper if too muchI opened it and I see where the SoC is. There is a thermal pad on top of it. What do I do now @rtyuakatsuki
yup that why samsung broke
whos you reply dev :vWhat ? Charging voltage 4,4 ?! In source code it's everywhere 4,35 V.
Also 4,35 V was for old phones like the Ace 2. Now I wonder if S8+ and Note8 has also 4,4 V spec. If so then I can update charger control to 4,4 V having more battery. That could increase battery life to 5 - 10%.
Yea, phone cooling is rlly a joke lol
Looks like Galaxy S8 can still surprise youWhat ? Charging voltage 4,4 ?! In source code it's everywhere 4,35 V.
Also 4,35 V was for old phones like the Ace 2. Now I wonder if S8+ and Note8 has also 4,4 V spec. If so then I can update charger control to 4,4 V having more battery. That could increase battery life to 5 - 10%.
I don’t have a copper plate. I have thermal paste. Where should I put it, should I remove the black thermal pad covering the chip?replace it with copper plate that best option i measure the thickness is 2.5 mm or 2mm better take 2.5 mm and use sandpaper if too much
Do you have S8+ ? Can you confirm if it has 4,4 V battery as well ?
I wonder how much hidden potential it has.
I mean, most of it is probably already out. If we had good cooling though, yeah. Plenty of power to releaseDo you have S8+ ? Can you confirm if it has 4,4 V battery as well ?
I wonder how much hidden potential it has.
That stock pad is touching the case or any parts to transfer the heat ? If so and you remove that fat pad and apply only the paste on the chip it'll loose contact to the case and the chip will overheat / damage withhin seconds. So make sure to not loose contact. If you can't replace the pad with something better, then keep it and just put the thermal paste between chip and pad. This is better than nothing and you should get better cooling.I don’t have a copper plate. I have thermal paste. Where should I put it, should I remove the black thermal pad covering the chip?
Thanks mate, yes, the pad is touching the heat sink and even has the sign of the heatsink on it if you look carefully. I removed it but luckily it still sticks just fine. I’ll apply the paste on it.That stock pad is touching the case or any parts to transfer the heat ? If so and you remove that fat pad and apply only the paste on the chip it'll loose contact to the case and the chip will overheat / damage withhin seconds. So make sure to not loose contact. If you can't replace the pad with something better, then keep it and just put the thermal paste between chip and pad. This is better than nothing and should get better cooling.
Ok then apply the paste also on top of the pad to make better contact to the heatsink. That's really bad solution, because the pad is not as good like having proper coopper plate, but still better than stock.Thanks mate, yes, the pad is touching the heat sink and even has the sign of the heatsink on it if you look carefully. I removed it but luckily it still sticks just fine. I’ll apply the paste on it.
It has a very weird rubbery pad under it that makes contact with the E8895 + MIF chip (which also is made out of plastic. Early 90s solution of making processors, EXTREMELY bad at conducting heat), in the middle then there is a grey-ish later that reminds of a very thin foil of metal, and then on top there is the black rubbery layer that you can see in the image. Combination of very bad cooling solutions. A copper pad would've probably made such a huge difference.Ok then apply the paste also on top of the pad to make better contact to the heatsink. That's really bad solution, because the pad is not as good like having proper coopper plate, but still better than stock.
wait dev i at low batteryDo you have S8+ ? Can you confirm if it has 4,4 V battery as well ?
I wonder how much hidden potential it has.
if you doesnt have copper plate buy it bro :v because you have been open the cageI don’t have a copper plate. I have thermal paste. Where should I put it, should I remove the black thermal pad covering the chip?
best solution for you @TechNoobForSale for whileThat stock pad is touching the case or any parts to transfer the heat ? If so and you remove that fat pad and apply only the paste on the chip it'll loose contact to the case and the chip will overheat / damage withhin seconds. So make sure to not loose contact. If you can't replace the pad with something better, then keep it and just put the thermal paste between chip and pad. This is better than nothing and you should get better cooling.
Dude I can't just go on google and search up "copper plate" and hope to find something that properly fits this phone. You have to address me.if you doesnt have copper plate buy it bro :v because you have been open the cage
I've tried this but not using decoyYea, probably gonna do that. Also question, if i put a decoy usb c to usb c between my charger and phone and triggers 9v in my charger and sends 9v forced to my phone, does that cause damage or doesnt that matter?
On the free version you still get many of the improvements and optimizations tha A2N Kernel offers over stock Kernel. Besides, this Kernel is dirt cheap while it literally revives your phone. 2 euros more out of a 800 euros phone, I think it's worth it.so if we don t buy full paid version we can t do anything and install kernel in vain?
NX Kernel. CPU OC up to 2.65. No GPU OC. No throttle control. Outdated, abandoned. RZ Kernel for 572MHz GPU OC. No CPU OC. No other Kernel other than this one fits your needs. No other S8 Kernel offers the same possibilities as A2N Kernel.guys anyone know a kernel that let cpu oc even 2.6 and some gpu oc ? that is all im intrested