That's a BGA. The heat has to be precisely controlled with a hot air station by someone that knows what they're doing. Too little heat/time nothing happens, too much you destroy it and the PCB maybe too.
These are the hardest SMs to deal with.
There's no guarantee that that's the problem and no way to inspect it without a factory test rig*.
All the contacts are underneath. It maybe another SM component that has the cracked solder joint. There are a lot of components in the power section. That maybe a common problem but not the only one...
*you can try gently pressing down on the chipset to see if it triggers an event.